Wafer-level Au–Au bonding in the 350–450 °C temperature range

Author： Tofteberg Hannah R Schjølberg-Henriksen Kari Fasting Eivind J Moen Alexander S Taklo Maaike M V Poppe Erik U Simensen Christian J

Publisher： IOP Publishing

ISSN： 0960-1317

Source： Journal of Micromechanics and Microengineering, Vol.24, Iss.8, 2014-08, pp. : 84002-84009

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