Benzotriazole removal on post-Cu CMP cleaning

By Jiying Tang   Yuling Liu   Ming Sun   Shiyan Fan   Yan Li  

Journal of Semiconductors, Vol. 36, Iss. 6, 2015-06 ,pp. : 66001-66004

IOP Publishing

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A novel cleaner for colloidal silica abrasive removal in post-Cu CMP cleaning

By Haiwen Deng   Baimei Tan   Baohong Gao   Chenwei Wang   Zhangbing Gu   Yan Zhang  

Journal of Semiconductors, Vol. 36, Iss. 10, 2015-10 ,pp. : 106002-106006

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Removal of residual CuO particles on the post CMP wafer surface of multi-layered copper

By Yan Li   Ming Sun   Xinhuan Niu   Yuling Liu   Yangang He   Hailong Li   Aochen Wang   Hongbo Li  

Journal of Semiconductors, Vol. 35, Iss. 4, 2014-04 ,pp. : 46001-46008

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On the impact of nanotopography of silicon wafers on post-CMP oxide layers

By Schmolke R.   Deters R.   Thieme P.   Pech R.   Schwenk H.   Diakourakis G.  

Materials Science in Semiconductor Processing, Vol. 5, Iss. 4, 2002-08 ,pp. : 413-418

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Cu-CMP for dual damascene technology: Prestonian vs. non-prestonian regimes of Cu removal

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Journal of Electronic Materials, Vol. 30, Iss. 4, 2001-04 ,pp. : 396-399

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