A novel cleaner for colloidal silica abrasive removal in post-Cu CMP cleaning

Author： Haiwen Deng   Baimei Tan   Baohong Gao   Chenwei Wang   Zhangbing Gu   Yan Zhang  

Publisher： IOP Publishing

ISSN： 1674-4926

Source： Journal of Semiconductors, Vol.36, Iss.10, 2015-10, pp. : 106002-106006

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