Low temperature drive-in of surface-deposited copper in silicon wafers

Author: Polignano M. L.   Caputo D.   Carpanese C.   Salvà G.   Vanzetti L.  

Publisher: Edp Sciences

E-ISSN: 1286-0050|27|1-3|435-438

ISSN: 1286-0042

Source: EPJ Applied Physics (The), Vol.27, Iss.1-3, 2010-03, pp. : 435-438

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Abstract