Related content

Timing Challenges for Very Deep Sub-Micron (VDSM) IC

By Lin I.  

VLSI Design, Vol. 15, Iss. 3, 2002-01 ,pp. : 557-562

Taylor & Francis Ltd

Access to resources Recommend Favorite

Process conditions in X-ray lithography for the fabrication of devices with sub-micron feature sizes

By Mappes Timo   Achenbach Sven   Mohr Juergen  

Microsystem Technologies, Vol. 13, Iss. 3-4, 2007-02 ,pp. : 355-360

Springer Publishing Company

Access to resources Recommend Favorite

Deep sub micron high aspect ratio polymer structures produced by hard X-ray lithography

By Achenbach S.  

Microsystem Technologies, Vol. 10, Iss. 6-7, 2004-10 ,pp. : 493-497

Springer Publishing Company

Access to resources Recommend Favorite

Design and development of sub-micron scale specimens with electroplated structures for the microtensile testing of thin films

By Lin Ming-Tzer   Tong Chi-Jia   Chiang Chung-Hsun  

Microsystem Technologies, Vol. 13, Iss. 11-12, 2007-07 ,pp. : 1559-1565

Springer Publishing Company

Access to resources Recommend Favorite

Submicron-scale surface acoustic wave resonators fabricated by high aspect ratio X-ray lithography and aluminum lift-off

By Achenbach Sven  

Microsystem Technologies, Vol. 14, Iss. 9-11, 2008-10 ,pp. : 1715-1719

Springer Publishing Company

Access to resources Recommend Favorite