Sputtered Encapsulation as Wafer Level Packaging for Isolatable MEMS Devices: A Technique Demonstrated on a Capacitive Accelerometer

Author： Hamzah Azrul Azlan Yunas Jumril Majlis Burhanuddin Yeop Ahmad Ibrahim

Publisher： MDPI

E-ISSN： 1424-8220|8|11|7438-7452

ISSN： 1424-8220

Source： Sensors, Vol.8, Iss.11, 2008-11, pp. : 7438-7452

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