Evaluation and Reduction of Epitaxial Wafer Defects Resulting from Carbon-Inclusion Defects in 4H-SiC Substrate

Publisher: Trans Tech Publications

E-ISSN: 1662-9752|2017|897|39-42

ISSN: 0255-5476

Source: Materials Science Forum, Vol.2017, Iss.897, 2017-06, pp. : 39-42

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Abstract