Corrosion inhibition by self-assembled monolayers for enhanced wire bonding on Cu surfaces

Author： Whelan C.M. Kinsella M. Carbonell L. Meng Ho H. Maex K.

Publisher： Elsevier

ISSN： 0167-9317

Source： Microelectronic Engineering, Vol.70, Iss.2, 2003-11, pp. : 551-557

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