Author： Das A. Le Q.T. Furukawa Y. Nguyen V.H. Terzieva V. de Theije F. Whelan C.M. Maenhoudt M. Struyf H. Tokei Z. Iacopi F. Stucchi M. Carbonell L. Vos I. Bender H. Patz M. Beyer G. Van Hove M. Maex K.
Publisher： Elsevier
ISSN： 0167-9317
Source： Microelectronic Engineering, Vol.70, Iss.2, 2003-11, pp. : 308-313
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