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Author: Iacopi F. Patz M. Vos I. Tokei Z. Sijmus B. Le Q.T. Sleeckx E. Eyckens B. Struyf H. Das A. Maex K.
Publisher: Elsevier
ISSN: 0167-9317
Source: Microelectronic Engineering, Vol.70, Iss.2, 2003-11, pp. : 293-301
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