

Period of time: 2016年7期
Publisher: IOP Publishing
Founded in: 1991
Total resources: 42
ISSN: 0960-1317
Subject: T Industrial Technology
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Journal of Micromechanics and Microengineering,volume 23,issue 7
Menu


By Leopold S,Mueller L,Kremin C,Hoffmann M in (2013)
Journal of Micromechanics and Microengineering,volume 23,issue 7 , Vol. 23, Iss. 7, 2013-07 , pp.
By Bu Minqiang,Perch-Nielsen Ivan R,Sørensen Karen S,Skov Julia,Sun Yi, ,Pedersen Michael E,Hansen Mikkel F,Wolff Anders in (2013)
Journal of Micromechanics and Microengineering,volume 23,issue 7 , Vol. 23, Iss. 7, 2013-07 , pp.
Design and characterization of AlN-based in-plane microplate resonators
By Ruiz-Díez V,Manzaneque T,Hernando-García J,Ababneh A,Kucera M,Schmid U,Seidel H,Sánchez-Rojas J L in (2013)
Journal of Micromechanics and Microengineering,volume 23,issue 7 , Vol. 23, Iss. 7, 2013-07 , pp.
Ordered arrays of patterned nanoporous silicon
By Wang D,Schönherr S,Ji R,Herz A,Ronning C,Schaaf P in (2013)
Journal of Micromechanics and Microengineering,volume 23,issue 7 , Vol. 23, Iss. 7, 2013-07 , pp.
Large area and broadband semi-reflective Bragg mirror membrane manufactured by PECVD
By Bertin H,Bosseboeuf A,Coste P,Péalat M,Roux N in (2013)
Journal of Micromechanics and Microengineering,volume 23,issue 7 , Vol. 23, Iss. 7, 2013-07 , pp.
Microfabrication of low thermal mass heated nebulizer chips for mass spectrometry
By Wirtssohn Matti,Sainiemi Lauri,Haapala Markus,Franssila Sami in (2013)
Journal of Micromechanics and Microengineering,volume 23,issue 7 , Vol. 23, Iss. 7, 2013-07 , pp.
By Hamzah A A,Abidin H E Zainal,Majlis B Yeop,Nor M Mohd,Ismardi A,Sugandi G,Tiong T Y,Dee C F,Yunas J in (2013)
Journal of Micromechanics and Microengineering,volume 23,issue 7 , Vol. 23, Iss. 7, 2013-07 , pp.
Tunable diffractive filters for robust NIR and IR spectroscopy
By Lacolle M,Johansen I R,Bakke T,Sagberg H in (2013)
Journal of Micromechanics and Microengineering,volume 23,issue 7 , Vol. 23, Iss. 7, 2013-07 , pp.
Ultra-thin layer packaging for implantable electronic devices
By Hogg A.,Aellen T.,Uhl S.,Graf B.,Keppner H.,Tardy Y.,Burger J. in (2013)
Journal of Micromechanics and Microengineering,volume 23,issue 7 , Vol. 23, Iss. 7, 2013-07 , pp.