Micromachined silicon cantilever beams for thin-film stress measurement

By Cardinale G.F.   Howitt D.G.   Clift W.M.   McCarty K.F.   Medlin D.L.   Mirkarimi P.B.   Moody N.R.  

Thin Solid Films, Vol. 287, Iss. 1, 1996-10 ,pp. : 214-219

Elsevier

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In situ tensile strength measurement and Weibull analysis of thick film and thin film micromachined polysilicon structures

By Greek S.   Ericson F.   Johansson S.   Schweitz J.-A.  

Thin Solid Films, Vol. 292, Iss. 1, 1997-01 ,pp. : 247-254

Elsevier

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Residual stress measurement in textured thin film by grazing-incidence X-ray diffraction

By Ma C.-H.   Huang J.-H.   Chen H.  

Thin Solid Films, Vol. 418, Iss. 2, 2002-10 ,pp. : 73-78

Elsevier

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The analysis of thermal stress effect on electromigration failure time in Al alloy thin-film interconnects

By Lee S.H.   Kwon D.  

Thin Solid Films, Vol. 341, Iss. 1, 1999-03 ,pp. : 136-139

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Analysis of bias stress on thin-film transistors obtained by Hot-Wire Chemical Vapour Deposition

By Dosev D.K.   Puigdollers J.   Orpella A.   Voz C.   Fonrodona M.   Soler D.   Marsal L.F.   Pallares J.   Bertomeu J.   Andreu J.   Alcubilla R.  

Thin Solid Films, Vol. 383, Iss. 1, 2001-02 ,pp. : 307-309

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