Improved TiN film as a diffusion barrier between copper and silicon

Author： Rha S.-K.   Lee W.-J.   Lee S.-Y.   Hwang Y.-S.   Lee Y.-J.   Kim D.-I.   Kim D.-W.   Chun S.-S.   Park C.-O.  

Publisher： Elsevier

ISSN： 0040-6090

Source： Thin Solid Films, Vol.320, Iss.1, 1998-05, pp. : 134-140

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