Effects of the high-pressure annealing process on the reflow phenomenon of copper interconnections for large scale integrated circuits

Author： Onishi T. Fujii H. Yoshikawa T. Munemasa J. Inoue T. Miyagaki A.

Publisher： Elsevier

ISSN： 0040-6090

Source： Thin Solid Films, Vol.425, Iss.1, 2003-02, pp. : 265-274

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