On the energy balance of substrate surfaces during plasma cleaning of lubricants

By Deutsch H.   Kersten H.   Behnke J.F.I.  

Vacuum, Vol. 48, Iss. 2, 1997-02 ,pp. : 123-128

Elsevier

Access to resources Recommend Favorite

On the energy influx to the substrate during sputter deposition of thin aluminium films

By Kersten H.   Kroesen G.M.W.   Hippler R.  

Thin Solid Films, Vol. 332, Iss. 1, 1998-11 ,pp. : 282-289

Elsevier

Access to resources Recommend Favorite

Pulsed high energy density plasma processing silicon surface

By Liu B.   Liu C.   Cheng D.   He R.   Yang S.-Z.  

Thin Solid Films, Vol. 390, Iss. 1, 2001-06 ,pp. : 149-153

Elsevier

Access to resources Recommend Favorite

Ion fraction and energy distribution of Ti flux incident to substrate surface in RF-plasma enhanced magnetron sputtering

By Fukushima K.   Kusano E.   Kikuchi N.   Saito T.   Saiki S.   Nanto H.   Kinbara A.  

Vacuum, Vol. 59, Iss. 2, 2000-11 ,pp. : 586-593

Elsevier

Access to resources Recommend Favorite

Proton channeling into the Si substrate at the bottom of ultrahigh-aspect-ratio contact holes during plasma etching

By Ichimori T.   Ikegami N.   Hirashita N.   Kanamori J.  

Thin Solid Films, Vol. 374, Iss. 2, 2000-10 ,pp. : 228-234

Elsevier

Access to resources Recommend Favorite