Surface oxide analysis of lead-free solder particles

Author： Luo Xin   Du Wenhui   Lu Xiuzhen   Yamaguchi Toshikazu   Jackson Gavin   Ye Li lei   Liu Johan  

Publisher： Emerald Group Publishing Ltd

ISSN： 0954-0911

Source： Soldering & Surface Mount Technology, Vol.25, Iss.1, 2013-02, pp. : 39-44

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Microstructural Analysis of Lead-Free Solder Alloys

By Kumar Vineet   Fang Zhigang Zak   Liang Jin   Dariavach Nader  

Metallurgical and Materials Transactions A, Vol. 37, Iss. 8, 2006-08 ,pp. : 2505-2514

Springer Publishing Company

Access to resources Recommend Favorite

The effect of PCB surface finish on lead-free solder joints

By Nurmi Sami T   Sundelin Janne J   Ristolainen Eero O   Lepistö Toivo K  

Soldering & Surface Mount Technology, Vol. 17, Iss. 1, 2005-01 ,pp. : 13-23

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Effect of PCB surface finish on creep properties of lead-free solder joints

By Sundelin Janne J   Nurmi Sami T   Lepistö Toivo K   Ristolainen Eero O  

Soldering & Surface Mount Technology, Vol. 17, Iss. 4, 2005-04 ,pp. : 3-9

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Failure analysis of lead-free solder joints for high-density packages

By Lau John   Shangguan Dongkai   Castello Todd   Horsley Rob   Smetana Joe   Hoo Nick   Dauksher Walter   Love Dave   Menis Irv   Sullivan Bob  

Soldering & Surface Mount Technology, Vol. 16, Iss. 2, 2004-08 ,pp. : 69-76

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Electrodeposition of lead-free solder alloys

By Goh Yingxin   Haseeb A.S.M.A.   Sabri Mohd Faizul Mohd  

Soldering & Surface Mount Technology, Vol. 25, Iss. 2, 2013-04 ,pp. : 76-90

Emerald Group Publishing Ltd

Access to resources Recommend Favorite