Reliability of tin-lead balled BGAs soldered with lead-free solder paste

By Nurmi Sami Tapani   Ristolainen Eero Olavi  

Soldering & Surface Mount Technology, Vol. 14, Iss. 2, 2002-07 ,pp. : 35-39

Emerald Group Publishing Ltd

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Thermal cycling reliability of lead-free chip resistor solder joints

By Suhling Jeffrey C.   Gale H.S.   Johnson R. Wayne   Islam M. Nokibul   Shete Tushar   Lall Pradeep   Bozack Michael J.   Evans John L.   Seto Ping   Gupta Tarun   Thompson James R.  

Soldering & Surface Mount Technology, Vol. 16, Iss. 2, 2004-08 ,pp. : 77-87

Emerald Group Publishing Ltd

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Design for lead-free solder joint reliability of high-density packages

By Lau John   Dauksher Walter   Smetana Joe   Horsley Rob   Shangguan Dongkai   Castello Todd   Menis Irv   Love Dave   Sullivan Bob  

Soldering & Surface Mount Technology, Vol. 16, Iss. 1, 2004-02 ,pp. : 12-26

Emerald Group Publishing Ltd

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A study of thermo-mechanical reliability of lead-free PTH solder joints

By Nguyen Jennifer   Geiger David   Rooney Dan   Shangguan Dongkai  

Soldering & Surface Mount Technology, Vol. 21, Iss. 2, 2009-04 ,pp. : 39-47

Emerald Group Publishing Ltd

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Electrodeposition of lead-free solder alloys

By Goh Yingxin   Haseeb A.S.M.A.   Sabri Mohd Faizul Mohd  

Soldering & Surface Mount Technology, Vol. 25, Iss. 2, 2013-04 ,pp. : 76-90

Emerald Group Publishing Ltd

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