Fatigue crack growth behavior of Sn-Pb and Sn-based lead-free solders

Author： Zhao J. Mutoh Y. Miyashita Y. Wang L.

Publisher： Elsevier

ISSN： 0013-7944

Source： Engineering Fracture Mechanics, Vol.70, Iss.15, 2003-10, pp. : 2187-2197

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