HotSpot: a dynamic compact thermal model at the processor-architecture level

Author： Stan M.R. Skadron K. Barcella M. Huang W. Sankaranarayanan K. Velusamy S.

Publisher： Elsevier

ISSN： 0026-2692

Source： Microelectronics, Vol.34, Iss.12, 2003-12, pp. : 1153-1165

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