Effect of voids on the reliability of BGA/CSP solder joints

Author: Yunus M.   Srihari K.   Pitarresi J.M.   Primavera A.  

Publisher: Elsevier

ISSN: 0026-2714

Source: Microelectronics Reliability, Vol.43, Iss.12, 2003-12, pp. : 2077-2086

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