Reliability evaluation of ultra-thin CSP using new flip-chip bonding technology--double-sided CSP and single-sided CSP

Author： Nishida K. Shimizu K. Yoshino M. Koguchi H. Taweejun N.

Publisher： Elsevier

ISSN： 0026-2714

Source： Microelectronics Reliability, Vol.43, Iss.12, 2003-12, pp. : 2065-2075

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