Author: Liu Y. Zhang K. Wang F. Han Y.
Publisher: Elsevier
ISSN: 0167-9317
Source: Microelectronic Engineering, Vol.66, Iss.1, 2003-04, pp. : 433-437
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
A study on the reproducibility of HSS STI-CMP process for ULSI applications
By Jeong S.-Y. Kim S.-Y. Seo Y.-J.
Microelectronic Engineering, Vol. 66, Iss. 1, 2003-04 ,pp. :
Design of experimental optimization for ULSI CMP process applications
By Park S.-W. Kim C.-B. Kim S.-Y. Seo Y.-J.
Microelectronic Engineering, Vol. 66, Iss. 1, 2003-04 ,pp. :
Benzotriazole removal on post-Cu CMP cleaning
By Jiying Tang Yuling Liu Ming Sun Shiyan Fan Yan Li
Journal of Semiconductors, Vol. 36, Iss. 6, 2015-06 ,pp. :
Non-ionic surfactant on particles removal in post-CMP cleaning
Journal of Semiconductors, Vol. 36, Iss. 2, 2015-02 ,pp. :