Correlation of electromigration lifetime distribution to failure mode in dual Damascene Cu/SiLK interconnects

Author： Gignac L.M.   Hu C.-K.   Liniger E.G.  

Publisher： Elsevier

ISSN： 0167-9317

Source： Microelectronic Engineering, Vol.70, Iss.2, 2003-11, pp. : 398-405

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