Effects of Zn-Containing Flux on Sn-3.5Ag Soldering with an Electroless Ni-P/Au Surface Finish: Microstructure and Wettability

By Sakurai Hitoshi  

Journal of Electronic Materials, Vol. 39, Iss. 12, 2010-12 ,pp. : 2598-2604

Springer Publishing Company

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Comparative study of the dissolution kinetics of electrolytic Ni and electroless Ni-P by the molten Sn3.5Ag0.5Cu solder alloy

By Islam M.N.   Chan Y.C.   Sharif A.   Alam M.O.  

Microelectronics Reliability, Vol. 43, Iss. 12, 2003-12 ,pp. : 2031-2037

Elsevier

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Early Interfacial Reaction and Formation of Intermetallic Compounds in the Sn-3.5Ag/Cu Soldering System

By Zhou M.  

Journal of Electronic Materials, Vol. 40, Iss. 2, 2011-02 ,pp. : 189-194

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Growth Mechanism of a Ternary (Cu,Ni) 6 Sn 5 Compound at the Sn(Cu)/Ni(P) Interface

By Huang T.  

Journal of Electronic Materials, Vol. 39, Iss. 11, 2010-11 ,pp. : 2382-2386

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Reactions of Sn-3.5Ag-Based Solders Containing Zn and Al Additions on Cu and Ni(P) Substrates

By Kotadia H.  

Journal of Electronic Materials, Vol. 39, Iss. 12, 2010-12 ,pp. : 2720-2731

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