Thermal resistance variation of HBT with high junction temperature and bias condition

Author： Su Y.-K.   Wei S.-C.   Chang L.-S.   Wang R.-L.   Wang C.J.  

Publisher： Elsevier

ISSN： 0038-1101

Source： Solid-State Electronics, Vol.47, Iss.11, 2003-11, pp. : 2113-2116

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