Adhesion interaction between electrolessly deposited copper film and polyimide

By Vorobyova T.N.  

Journal of Adhesion Science and Technology, Vol. 11, Iss. 2, 1997-01 ,pp. : 167-182

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Improvement in the adhesion between copper metal and polyimide substrate by plasma polymer deposition of cyano compounds onto polyimide

By Inagaki N.   Tasaka S.   Ohmori H.   Mibu S.  

Journal of Adhesion Science and Technology, Vol. 10, Iss. 3, 1996-01 ,pp. : 243-256

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Effects of environment and heat treatment on an oxygen plasma-treated polyimide surface and its adhesion to a chromium overcoat

By Katnani A.D.   Knoll A.   Mycek M.A.  

Journal of Adhesion Science and Technology, Vol. 3, Iss. 1, 1989-01 ,pp. : 441-453

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Surface modification of polymers and improvement of the adhesion between evaporated copper metal film and a polymer. I. Chemical modification of PET

By Kim Eun-Young   Kong Ju-Shik   An Seung-Kook   Kim Han-Do  

Journal of Adhesion Science and Technology, Vol. 14, Iss. 9, 2000-05 ,pp. : 1119-1130

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Adhesion and interface studies between copper and polyimide

By Kim Y.-H.   Walker G.F.   Kim J.   Park J.  

Journal of Adhesion Science and Technology, Vol. 1, Iss. 1, 1987-01 ,pp. : 331-339

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