Plasma surface modification of polyimide for improving adhesion to electroless copper coatings

By Rozovskis G.   Vinkevičius J.   Jačiauskiene J.  

Journal of Adhesion Science and Technology, Vol. 10, Iss. 5, 1996-01 ,pp. : 399-406

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Improvement in the adhesion between copper metal and polyimide substrate by plasma polymer deposition of cyano compounds onto polyimide

By Inagaki N.   Tasaka S.   Ohmori H.   Mibu S.  

Journal of Adhesion Science and Technology, Vol. 10, Iss. 3, 1996-01 ,pp. : 243-256

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An XPS study of argon ion beam and oxygen RIE modified BPDA-PDA polyimide as related to adhesion

By Flitsch Richard  

Journal of Adhesion Science and Technology, Vol. 10, Iss. 12, 1996-01 ,pp. : 1241-1253

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Adhesion enhancement of thin copper film on polyimide modified by oxygen reactive ion beam etching

By Paik Kyung W.   Ruoff Arthur L.  

Journal of Adhesion Science and Technology, Vol. 4, Iss. 1, 1990-01 ,pp. : 465-474

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Effects of environment and heat treatment on an oxygen plasma-treated polyimide surface and its adhesion to a chromium overcoat

By Katnani A.D.   Knoll A.   Mycek M.A.  

Journal of Adhesion Science and Technology, Vol. 3, Iss. 1, 1989-01 ,pp. : 441-453

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