Formation of polyimide- Cu complexes: improvement of direct Cu-on-PI and PI-on-Cu adhesion

Author： Lee K.-W.   Walker G.F.   Viehbeck A.  

Publisher： Taylor & Francis Ltd

ISSN： 1568-5616

Source： Journal of Adhesion Science and Technology, Vol.9, Iss.8, 1995-01, pp. : 1125-1141

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