Footprints of Fine Pitch SMDs

By Wassink R.J. Klein  

Circuit World, Vol. 18, Iss. 2, 1993-12 ,pp. : 5-12

Emerald Group Publishing Ltd

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A multilayer process for the connection of fine-pitch-devices on molded interconnect devices (MIDs)

By Leneke Thomas   Hirsch Soeren   Schmidt Bertram  

Circuit World, Vol. 35, Iss. 2, 2009-05 ,pp. : 23-29

Emerald Group Publishing Ltd

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Immersion tin as a high performance solderable finish for fine pitch PWBs

By Ormerod David H  

Circuit World, Vol. 26, Iss. 3, 2000-03 ,pp. : 11-16

Emerald Group Publishing Ltd

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Solder bridging test to evaluate the compatibility for fine-pitch microsoldering

By Takemoto Tadashi   Funaki Tatsuya   Miyazaki Makoto   Matsunawa Akira  

Circuit World, Vol. 24, Iss. 1, 1998-01 ,pp. : 39-44

Emerald Group Publishing Ltd

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Analytical and Experimental Studies of 208-pin Fine Pitch (0·5 mm) Quad Flat Pack Solder-joint Reliability

By Lau J.   Dody G.   Chen W.   McShane M.   Rice D.   Erasmus S.   Adamjee W.  

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Emerald Group Publishing Ltd

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