Fluxless Flip-chip Bonding on Flexible Substrates: A Comparison between Adhesive Bonding and Soldering*

By Aschenbrenner R   Zakel E   Azdasht** G   Kloeser A   H.Reichl  

Soldering & Surface Mount Technology, Vol. 8, Iss. 2, 1996-02 ,pp. : 5-11

Emerald Group Publishing Ltd

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Finite element analysis of flip?–?chip on board (FCOB) assembly during reflow soldering process

By Addagarla Annapurna   Prasad N. Siva  

Soldering & Surface Mount Technology, Vol. 24, Iss. 2, 2012-04 ,pp. : 92-99

Emerald Group Publishing Ltd

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Sub process challenges in ultra fine pitch stencil printing of type-6 and type-7 Pb-free solder pastes for flip chip assembly applications

By Jackson G.J.   Hendriksen M.W.   Kay R.W.   Desmulliez M   Durairaj R.K.   Ekere N.N.  

Soldering & Surface Mount Technology, Vol. 17, Iss. 1, 2005-01 ,pp. : 24-32

Emerald Group Publishing Ltd

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The effects of bump height on the reliability of ACF in flip-chip

By Wu C.M.L.   Liu Johan   Yeung N.H.  

Soldering & Surface Mount Technology, Vol. 13, Iss. 1, 2001-01 ,pp. : 25-30

Emerald Group Publishing Ltd

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Failures of flip chip assemblies under thermal shock

By Bo Cheng   Li Wang   Qun Zhang   Xia Gao   Xiaoming Xie   Kempe Wolfgang  

Soldering & Surface Mount Technology, Vol. 15, Iss. 3, 2003-12 ,pp. : 27-32

Emerald Group Publishing Ltd

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