Failures of flip chip assemblies under thermal shock

Author: Bo Cheng   Li Wang   Qun Zhang   Xia Gao   Xiaoming Xie   Kempe Wolfgang  

Publisher: Emerald Group Publishing Ltd

ISSN: 0954-0911

Source: Soldering & Surface Mount Technology, Vol.15, Iss.3, 2003-12, pp. : 27-32

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