Author: Bo Cheng Li Wang Qun Zhang Xia Gao Xiaoming Xie Kempe Wolfgang
Publisher: Emerald Group Publishing Ltd
ISSN: 0954-0911
Source: Soldering & Surface Mount Technology, Vol.15, Iss.3, 2003-12, pp. : 27-32
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
By Ye Tian The School of Mechanical and Electrical Engineering Henan University of Technology Zhengzhou China AND The George W. Woodruff School of Mechanical Engineering Georgia Institute of Technology Atlanta GA USAThe School of Mechanical and Electrical Engineering Henan University of Technology Zhengzhou China AND The George W. Woodruff School of Mechanical Engineering Georgia Institute of Technology Atlanta GA USA ChowJustinThe George W. Woodruff School of Mechanical Engineering Georgia Institute of Technology Atlanta GA USA LiuXiThe George W. Woodruff School of Mechanical Engineering Georgia Institute of Technology Atlanta GA USA SitaramanSuresh K.The George W. Woodruff School of Mechanical Engineering Georgia Institute of Technology Atlanta GA USA
Soldering & Surface Mount Technology, Vol. 27, Iss. 4, 2015-09 ,pp. :
By Stoyanov Stoyan Bailey Chris Desmulliez Marc
Soldering & Surface Mount Technology, Vol. 21, Iss. 1, 2009-02 ,pp. :