Strategies for improving the reliability of solder joints on power semiconductor devices

Author: Lu Guo-Quan   Liu Xingsheng   Wen Sihua   Calata Jesus Noel   Bai John G.  

Publisher: Emerald Group Publishing Ltd

ISSN: 0954-0911

Source: Soldering & Surface Mount Technology, Vol.16, Iss.2, 2004-08, pp. : 27-40

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Abstract