Soldering & Surface Mount Technology,volume 16,issue 2  (08-2015)

Period of time: 2015年2期

Publisher: Emerald Group Publishing Ltd

Founded in: 1981

Total resources: 58

ISSN: 0954-0911

Subject: TF Metallurgical Industry

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Soldering & Surface Mount Technology,volume 16,issue 2

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Reliability testing and data analysis of lead-free solder joints for high-density packages

By Lau John,Hoo Nick,Horsley Rob,Smetana Joe,Shangguan Dongkai,Dauksher Walter,Love Dave,Menis Irv,Sullivan Bob in (2004)

Soldering & Surface Mount Technology,volume 16,issue 2 , Vol. 16, Iss. 2, 2004-08 , pp. 46-68

Emerald Group Publishing Ltd

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Failure analysis of lead-free solder joints for high-density packages

By Lau John,Shangguan Dongkai,Castello Todd,Horsley Rob,Smetana Joe,Hoo Nick,Dauksher Walter,Love Dave,Menis Irv,Sullivan Bob in (2004)

Soldering & Surface Mount Technology,volume 16,issue 2 , Vol. 16, Iss. 2, 2004-08 , pp. 69-76

Emerald Group Publishing Ltd

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Thermal cycling reliability of lead-free chip resistor solder joints

By Suhling Jeffrey C.,Gale H.S.,Johnson R. Wayne,Islam M. Nokibul,Shete Tushar,Lall Pradeep,Bozack Michael J.,Evans John L.,Seto Ping,Gupta Tarun,Thompson James R. in (2004)

Soldering & Surface Mount Technology,volume 16,issue 2 , Vol. 16, Iss. 2, 2004-08 , pp. 77-87

Emerald Group Publishing Ltd

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