Period of time: 2015年2期
Publisher: Emerald Group Publishing Ltd
Founded in: 1981
Total resources: 58
ISSN: 0954-0911
Subject: TF Metallurgical Industry
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Soldering & Surface Mount Technology,volume 16,issue 2
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Long term mechanical reliability with lead-free solders
Soldering & Surface Mount Technology,volume 16,issue 2 , Vol. 16, Iss. 2, 2004-08 , pp.By Yan Eric C.C.,Lee S.W. Ricky,Huang X. in (2004)
Soldering & Surface Mount Technology,volume 16,issue 2 , Vol. 16, Iss. 2, 2004-08 , pp.Strategies for improving the reliability of solder joints on power semiconductor devices
By Lu Guo-Quan,Liu Xingsheng,Wen Sihua,Calata Jesus Noel,Bai John G. in (2004)
Soldering & Surface Mount Technology,volume 16,issue 2 , Vol. 16, Iss. 2, 2004-08 , pp.CBGA solder joint thermal fatigue life estimation by a simple method
By Wong T.E.,Lau C.Y.,Fenger H.S. in (2004)
Soldering & Surface Mount Technology,volume 16,issue 2 , Vol. 16, Iss. 2, 2004-08 , pp.Reliability testing and data analysis of lead-free solder joints for high-density packages
By Lau John,Hoo Nick,Horsley Rob,Smetana Joe,Shangguan Dongkai,Dauksher Walter,Love Dave,Menis Irv,Sullivan Bob in (2004)
Soldering & Surface Mount Technology,volume 16,issue 2 , Vol. 16, Iss. 2, 2004-08 , pp.Failure analysis of lead-free solder joints for high-density packages
By Lau John,Shangguan Dongkai,Castello Todd,Horsley Rob,Smetana Joe,Hoo Nick,Dauksher Walter,Love Dave,Menis Irv,Sullivan Bob in (2004)
Soldering & Surface Mount Technology,volume 16,issue 2 , Vol. 16, Iss. 2, 2004-08 , pp.Thermal cycling reliability of lead-free chip resistor solder joints
By Suhling Jeffrey C.,Gale H.S.,Johnson R. Wayne,Islam M. Nokibul,Shete Tushar,Lall Pradeep,Bozack Michael J.,Evans John L.,Seto Ping,Gupta Tarun,Thompson James R. in (2004)
Soldering & Surface Mount Technology,volume 16,issue 2 , Vol. 16, Iss. 2, 2004-08 , pp.