The effects of surface finish on the reliability of lead free and tin lead chip scale package solder joints

Author： Huang Meng-Kuang Lee Chiapyng Wu Pei-Lin Tzan Shyh-Rong

ISSN： 0954-0911

Source： Soldering & Surface Mount Technology, Vol.17, Iss.3, 2005-09, pp. : 3-8

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