Ultrasonic bonding of flexible PCB to rigid PCB using an Sn interlayer

Author: Kim Kyoo-Seok   Jung Jae-Pil   Zhou Y. Norman  

Publisher: Emerald Group Publishing Ltd

ISSN: 0954-0911

Source: Soldering & Surface Mount Technology, Vol.21, Iss.1, 2009-02, pp. : 4-10

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract