Soldering & Surface Mount Technology,volume 21,issue 1  (02-2015)

Period of time： 2015年1期

Publisher： Emerald Group Publishing Ltd

Founded in： 1981

Total resources： 58

ISSN： 0954-0911

Subject： TF Metallurgical Industry

Favorite

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Soldering & Surface Mount Technology,volume 21,issue 1

Menu

Ultrasonic bonding of flexible PCB to rigid PCB using an Sn interlayer

By Kim Kyoo-Seok,Jung Jae-Pil,Zhou Y. Norman in (2009)

Soldering & Surface Mount Technology,volume 21,issue 1 , Vol. 21, Iss. 1, 2009-02 , pp. 4-10

Emerald Group Publishing Ltd

Abstract Access to resources Recommend Favorite

Optimisation modelling for thermal fatigue reliability of lead-free interconnects in fine-pitch flip-chip packaging

By Stoyanov Stoyan,Bailey Chris,Desmulliez Marc in (2009)

Soldering & Surface Mount Technology,volume 21,issue 1 , Vol. 21, Iss. 1, 2009-02 , pp. 11-24

Emerald Group Publishing Ltd

Abstract Access to resources Recommend Favorite

Geometry control of solder interconnects via induction heating

By Xu Hongbo,Li Mingyu,Fu Yonggao,Wang Ling,Kim Jongmyung in (2009)

Soldering & Surface Mount Technology,volume 21,issue 1 , Vol. 21, Iss. 1, 2009-02 , pp. 25-30

Emerald Group Publishing Ltd

Abstract Access to resources Recommend Favorite

Lead-free solder joint reliability estimation of flip chip package using FEM-based sensitivity analysis

By Lee Chang-Chun,Chang Kuo-Chin,Yang Ya-Wen in (2009)

Soldering & Surface Mount Technology,volume 21,issue 1 , Vol. 21, Iss. 1, 2009-02 , pp. 31-41

Emerald Group Publishing Ltd

Abstract Access to resources Recommend Favorite

Total 4 item(s)