The growth behaviours of IMC layers in solid-liquid interfacial reactions of Sn1.5Cu/Cu in high magnetic fields

By Cheng Cong-qian   Zhao Jie   Xu Yang   Xu Fu-Min   Huang Ming-liang  

Soldering & Surface Mount Technology, Vol. 21, Iss. 2, 2009-04 ,pp. : 14-18

Emerald Group Publishing Ltd

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Silver nanoparticles effect on the wettability of Sn-Ag-Cu solder pastes and solder joints microstructure on copper

By Bukat K.   Koscielski M.   Sitek J.   Jakubowska M.   Mlozniak A.  

Soldering & Surface Mount Technology, Vol. 23, Iss. 3, 2011-06 ,pp. : 150-160

Emerald Group Publishing Ltd

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Effect of minor additions of Fe on bulk alloy microstructure and tensile properties of the low Ag-content Sn-1Ag-0.5Cu solder alloy

By Shnawah Dhafer Abdul Ameer   Said Suhana Binti Mohd   Sabri Mohd Faizul Bin Mohd   Badruddin Irfan Anjum   Che Fa Xing  

Soldering & Surface Mount Technology, Vol. 24, Iss. 4, 2012-09 ,pp. : 257-266

Emerald Group Publishing Ltd

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The effect of Pb contamination on the microstructure and mechanical properties of SnAg/Cu and SnSb/Cu solder joints in SMT

By Zhu Qinong   Sheng Mei   Luo Le  

Soldering & Surface Mount Technology, Vol. 12, Iss. 3, 2000-12 ,pp. : 19-24

Emerald Group Publishing Ltd

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A comparative study of microstructure and mechanical properties among Cu/Sn/Cu, Ni/Sn/Ni and Cu/Sn/Ni solder joints

By Wang Bo   Wu Fengshun   Wu Yiping   An Bing   Liu Hui   Zou Jian  

Soldering & Surface Mount Technology, Vol. 23, Iss. 1, 2011-02 ,pp. : 40-46

Emerald Group Publishing Ltd

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