Combifilm: A Novel Thick- and Thin-film Technology with Two Signal Layers for High-speed Hybrid Circuits Signal Layers for High-speed Hybrid Circuits*

By Pedersen U.P.I.   O.Aaserud**   Bungum*** O.W.  

Microelectronics International, Vol. 13, Iss. 1, 1996-01 ,pp. : 16-19

Emerald Group Publishing Ltd

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Compliant substrates: A comparative study of the relaxation mechanisms of strained films bonded to high and low viscosity oxides

By Hobart K.   Kub F.   Fatemi M.   Twigg M.   Thompson P.   Kuan T.   Inoki C.  

Journal of Electronic Materials, Vol. 29, Iss. 7, 2000-07 ,pp. : 897-900

Springer Publishing Company

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Preparation of PZT(53/47) thick films deposited by a dip-coating process

By He X.-Y.   Ding A.-L.   Zheng X.-S.   Qiu P.-S.   Luo W.-G.  

Microelectronic Engineering, Vol. 66, Iss. 1, 2003-04 ,pp. : 865-871

Elsevier

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Reduction of photoresist usage during spin coating

By Chou Fu-Chu   Wang Min-Wen   Gong Shih-Ching   Yang Zen-Gi  

Journal of Electronic Materials, Vol. 30, Iss. 4, 2001-04 ,pp. : 432-438

Springer Publishing Company

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Interconnection Technology for Advanced High Density Thick Films*

By M.Vrana   Calster A.Van   Berghe** R.Vanden   K.Allaert**  

Microelectronics International, Vol. 13, Iss. 3, 1996-03 ,pp. : 5-8

Emerald Group Publishing Ltd

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