Fatigue Properties of BGA Solder Joints: A Comparison of Thermal and Power Cycle Tests*

ISSN： 1356-5362

Source： Microelectronics International, Vol.14, Iss.3, 1997-03, pp. : 21-30

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Effect of voids on the reliability of BGA/CSP solder joints

By Yunus M. Srihari K. Pitarresi J.M. Primavera A.

Microelectronics Reliability, Vol. 43, Iss. 12, 2003-12 ,pp. : 2077-2086

Elsevier

Access to resources Recommend Favorite

Fatigue-creep crack propagation path in solder joints under thermal cycling

By Liu D. Pao Yi-Hsin

Journal of Electronic Materials, Vol. 26, Iss. 9, 1997-09 ,pp. : 1058-1064

Springer Publishing Company

Access to resources Recommend Favorite

Finite element modeling of thermal fatigue and damage of solder joints in a ceramic ball grid array package

By Hong Bor

Journal of Electronic Materials, Vol. 26, Iss. 7, 1997-07 ,pp. : 814-820

Springer Publishing Company

Access to resources Recommend Favorite

A Probabilistic Approach to Predict Thermal Fatigue Life for Ball Grid Array Solder Joints

By Wei Helin

Journal of Electronic Materials, Vol. 40, Iss. 11, 2011-11 ,pp. : 2314-2319

Springer Publishing Company

Access to resources Recommend Favorite

Comparison of Extensive Thermal Cycling Effects on Microstructure Development in Micro-alloyed Sn-Ag-Cu Solder Joints

By Anderson Iver

Journal of Electronic Materials, Vol. 41, Iss. 2, 2012-02 ,pp. : 390-397

Springer Publishing Company

Access to resources Recommend Favorite