Chemical characterization of failures and process materials for microelectronics assembly

Author: Huang Chien-Yi   Li Ming-Shu   Ku Chen-Liang   Hsieh Hao-Chun   Li Kung-Cheng  

Publisher: Emerald Group Publishing Ltd

ISSN: 1356-5362

Source: Microelectronics International, Vol.26, Iss.3, 2009-07, pp. : 41-48

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Abstract