Measurement of interdiffusion coefficients in Co–AI and Ni–AI systems between 1000 and 1200°C

By Green A.   Swindells N.  

Materials Science and Technology, Vol. 1, Iss. 2, 1985-02 ,pp. : 101-103

Maney Publishing

Access to resources Recommend Favorite

In situ test structures for the thermal expansion coefficient and residual stress of polysilicon thin films

By Liu Hai-Yun   Li Wei-Hua   Zhou Zai-Fa   Huang Qing-An  

Journal of Micromechanics and Microengineering, Vol. 23, Iss. 7, 2013-07 ,pp. : 75019-75027

IOP Publishing

Access to resources Recommend Favorite

Evaluation of Residual Stress in Thin Ferroelectric Films Using Grazing Incident X-Ray Diffraction

By PETROV Peter   SARMA KUMARAVINOTHAN   ALFORD NEIL  

Integrated Ferroelectrics, Vol. 63, Iss. 1, 2004-01 ,pp. : 183-189

Taylor & Francis Ltd

Access to resources Recommend Favorite

Residual stress development and relief in high strength aluminium alloys using standard and retrogression thermal treatments

By Robinson J. S.   Tanner D. A.  

Materials Science and Technology, Vol. 19, Iss. 4, 2003-04 ,pp. : 512-518

Maney Publishing

Access to resources Recommend Favorite

Characterization of the Young’s modulus, residual stress and fracture strength of Cu–Sn–In thin films using combinatorial deposition and micro-cantilevers

By Sasangka Wardhana A   Lai Donny   Thompson Carl V   Sasangka Wardhana A   Sasangka Wardhana A  

Journal of Micromechanics and Microengineering, Vol. 25, Iss. 3, 2015-03 ,pp. : 35023-35036

IOP Publishing

Access to resources Recommend Favorite