In situ test structures for the thermal expansion coefficient and residual stress of polysilicon thin films

Author: Liu Hai-Yun   Li Wei-Hua   Zhou Zai-Fa   Huang Qing-An  

Publisher: IOP Publishing

ISSN: 0960-1317

Source: Journal of Micromechanics and Microengineering, Vol.23, Iss.7, 2013-07, pp. : 75019-75027

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Abstract