Comparison of spreading behaviour and interfacial microstructure in Sn-0·7Cu, Sn-0·3Ag-0·7Cu and Sn-2·5Ag-0·5Cu lead free solder alloys on Fe-42Ni substrate

Author： Narayan S   Prabhu K N  

Publisher： Maney Publishing

ISSN： 1743-2847

Source： Materials Science and Technology, Vol.29, Iss.4, 2013-04, pp. : 464-473

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