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Maney Publishing

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Effect of fine dispersoids and anisotropic nature of β-Sn on thermal fatigue properties of flip chips connected by Sn–xAg–0·5Cu (x: 1, 3 and 4 mass-%) lead free solders

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Influence of Indium and Antimony Additions on Mechanical Properties and Microstructure of Sn-3.0Ag-0.5Cu Lead Free Solder Alloys

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Thermal fatigue endurance of Sn3Ag0.5Cu0.5In0.05Ni and Sn2.5Ag0.8Cu0.5Sb solders in composite solder joints of LTCC/PWB assemblies

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