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IOP Publishing

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Optimization of innovative approaches to the shortening of filling times in 3D integrated through-silicon vias (TSVs)

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Journal of Micromechanics and Microengineering, Vol. 25, Iss. 4, 2015-04 ,pp. : 45009-45019

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Simultaneous filling of through silicon vias (TSVs) with different aspect ratios using multi-step direct current density

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The fabrication of a double-layer atom chip with through silicon vias for an ultra-high-vacuum cell

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From research to cost-effective directional solidification and single-crystal production – an integrated approach

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