A new binderless thick-film piezoelectric paste

By Cotton Darryl   Chappell Paul   Cranny Andy   White Neil  

Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 10, 2007-10 ,pp. : 1037-1044

Springer Publishing Company

Access to resources Recommend Favorite

Standardization of a shear test method for lead-free solder paste chip joints

By Choi Jai-Kyoung   Park Jai-Hyun   Ahn Yong-Sik  

Journal of Materials Science, Vol. 42, Iss. 17, 2007-09 ,pp. : 7451-7456

Springer Publishing Company

Access to resources Recommend Favorite

The development of the microstructural and electrical characteristics of NTC thick-film thermistors during firing

By Hrovat Marko   Belavič Darko   Holc Janez   Cilenšek Jena  

Journal of Materials Science, Vol. 41, Iss. 18, 2006-09 ,pp. : 5900-5906

Springer Publishing Company

Access to resources Recommend Favorite

The development of microstructural and electrical characteristics in some thick-film resistors during firing

By Hrovat M.   Samardžija Z.   Holc J.   Belavič D.  

Journal of Materials Science, Vol. 37, Iss. 11, 2002-06 ,pp. : 2331-2339

Springer Publishing Company

Access to resources Recommend Favorite

Effect of composition and thermal cycling on the adhesion strength of Sn-Zn-Al solder hot-dipped on Cu substrate

By Yu S-P.   Wang H-C.   Wang M-C.   Hon M-H.  

Journal of Materials Science, Vol. 37, Iss. 1, 2002-01 ,pp. : 185-190

Springer Publishing Company

Access to resources Recommend Favorite