Suppression of interfacial intermetallic compounds between Sn-9Zn solder and Cu-substrate by adding Cu-particles in the solder

By Wei G.  

Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 130-135

Springer Publishing Company

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Effect of composition and thermal cycling on the adhesion strength of Sn-Zn-Al solder hot-dipped on Cu substrate

By Yu S-P.   Wang H-C.   Wang M-C.   Hon M-H.  

Journal of Materials Science, Vol. 37, Iss. 1, 2002-01 ,pp. : 185-190

Springer Publishing Company

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Investigation of interfacial reaction and joint reliability between eutectic Sn–3.5Ag solder and ENIG-plated Cu substrate during high temperature storage test

By Yoon Jeong-Won   Chun Hyun-Suk   Jung Seung-Boo  

Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 5, 2007-05 ,pp. : 559-567

Springer Publishing Company

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Interfacial reactions between eutectic Sn–Pb solder and Co substrate

By Wang Chao-hong   Kuo Chun-yi  

Journal of Materials Science, Vol. 46, Iss. 8, 2011-04 ,pp. : 2654-2661

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Effects of electromigration on resistance changes in eutectic SnBi solder joints

By Sun Jia   Xu Guangchen   Guo Fu   Xia Zhidong   Lei Yongping   Shi Yaowu   Li Xiaoyan   Wang Xitao  

Journal of Materials Science, Vol. 46, Iss. 10, 2011-05 ,pp. : 3544-3549

Springer Publishing Company

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