Study of interfacial reactions in ionized metal plasma (IMP) deposited Al-0.5%wtCu/Ti/SiO2/Si structure

Author: Lee Y.K.   Latt K.M.   Jaehyung K.   Osipowicz T.   Chiam S-Y.   Lee K.  

Publisher: Springer Publishing Company

ISSN: 0022-2461

Source: Journal of Materials Science, Vol.35, Iss.23, 2000-12, pp. : 5857-5860

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