Intermetallic reactions in a Sn-3.5Ag-1.5In solder ball-grid-array package with Au/Ni/Cu pads

By Chen Jie  

Journal of Materials Science: Materials in Electronics, Vol. 22, Iss. 11, 2011-11 ,pp. : 1703-1708

Springer Publishing Company

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Interfacial reactions of Sn-3.5% Ag and Sn-3.5% Ag-0.5% Cu solder with electroless Ni/Au metallization during multiple reflow cycles

By Sharif Ahmed   Chan Y.  

Journal of Materials Science: Materials in Electronics, Vol. 16, Iss. 3, 2005-03 ,pp. : 153-158

Springer Publishing Company

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The influence of Pd on growth behavior of a quaternary (Cu,Ni,Pd)₆Sn₅ compound in Sn–3.0Ag–0.5Cu/Au/Pd/Ni–P solder joint during a liquid state reaction

By Tseng Chien-Fu   Duh Jenq-Gong  

Journal of Materials Science, Vol. 48, Iss. 2, 2013-01 ,pp. : 857-865

Springer Publishing Company

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Suppression of Cu 3 Sn and Kirkendall voids at Cu/Sn-3.5Ag solder joints by adding a small amount of Ge

By Yu Chun  

Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 56-60

Springer Publishing Company

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Materials behaviour and intermetallics characteristics in the reaction between SnAgCu and Sn–Pb solder alloys

By Liu Changqing   Huang Zhiheng   Conway Paul   Thomson Rachel  

Journal of Materials Science, Vol. 42, Iss. 11, 2007-06 ,pp. : 4076-4086

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