Rare-earth additions to lead-free electronic solders

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Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 1-3, 2007-03 ,pp. : 77-91

Springer Publishing Company

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Interfacial reaction issues for lead-free electronic solders

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Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 1-3, 2007-03 ,pp. : 155-174

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Tin pest issues in lead-free electronic solders

By Plumbridge W.  

Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 1-3, 2007-03 ,pp. : 307-318

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Impression creep of monolithic and composite lead free solders

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Journal of Materials Science, Vol. 42, Iss. 17, 2007-09 ,pp. : 7592-7600

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A study of Sn-Bi-Ag-(In) lead-free solders

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